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FAQ

• 26

  Aug, 2025

  Classification of silicone adhesives

  Silicone adhesives are categorized as either one-component or two-component.

  
  

  Single-component silicone adhesives cure by undergoing a physical property change upon contact with moisture in the air.

  
  

  Two-component silicone adhesives are divided into two components, A and B. Neither component alone will cure, but once the two components are mixed, they will begin to cure.

  
  

  One-component silicone glass adhesives are commonly found in the market. These adhesives are further categorized by their properties as acidic and neutral.

  
  

  Acidic glass adhesives are primarily used for general bonding between glass and other building materials. Neutral adhesives overcome the corrosion and alkaline properties of acidic adhesives, making them more widely applicable and offering a slightly higher market price than acidic adhesives.

  
  

  A more unique type of glass adhesive in the market is silicone structural sealant. Because they are used directly for bonding metal and glass structures in glass curtain walls or for non-structural installations, they have the highest quality requirements and product quality among glass adhesives, resulting in the highest market price.

  
  

  1. Primarily used for structural or non-structural bonding between metal and glass in glass curtain walls.

  2. It can directly connect glass to the exterior of metal components to form a single mounting assembly, meeting the requirements of fully or semi-concealed frame curtain wall designs.

  3. Structural bonding and sealing of insulating glass.

• 26

  Aug, 2025

  What is silicone?

  Most people only have a superficial understanding of silicones, believing them to be a superior resin in adhesives. The following details the details: Organosilicon compounds are compounds containing Si-C bonds and at least one organic group directly attached to a silicon atom. Compounds in which the organic group is attached to the silicon atom through oxygen, sulfur, nitrogen, or other molecules are also commonly considered organosilicon compounds. Among these, polysiloxanes, composed of a silicon-oxygen bond (-Si-O-Si-) as their backbone, are the most numerous, most extensively studied, and most widely used type of organosilicon compound, accounting for over 90% of total usage.

  
  

  Organosilicon materials share a common structure: sufficient methyl groups on the Si atoms shield the high-energy polysiloxane backbone; the C-H bonds are non-polar, resulting in very weak intermolecular interactions; the Si-O bonds are long, with large Si-O-Si bond angles; and the Si-O bonds are covalent bonds with 50% ionic characteristics (covalent bonds are directional, while ionic bonds are non-directional).

  
  

  Due to their unique structure, silicones combine the properties of both inorganic and organic materials, exhibiting advanced fundamental properties such as low surface tension, low viscosity-temperature coefficient, high compressibility, and gas permeability. They also possess excellent properties such as high and low temperature resistance, electrical insulation, oxidation stability, weather resistance, flame retardancy, hydrophobicity, corrosion resistance, non-toxicity, odorlessness, and physiological inertness. They are widely used in aerospace, electronics, construction, transportation, chemicals, textiles, food, light industry, and healthcare. Silicones are primarily used for sealing, bonding, lubrication, coating, surface active agents, mold release, defoaming, foam suppression, waterproofing, moisture-proofing, and inert filling. With the continued growth in the number and variety of silicones, their application areas are constantly expanding, forming a unique and important product system in the new chemical materials industry, many of which are irreplaceable and indispensable to other chemicals.

• 26

  Aug, 2025

  How to use epoxy resin and precautions

  Epoxy glue is a type of adhesive that cures quickly. It generally comes in three colors: white, black, and gray. Its main ingredient is epoxy resin. However, epoxy glue requires a curing process, so a curing agent is required. This type of adhesive cures very quickly, creates a strong bond, and provides excellent waterproofing. It can also be used in high-temperature environments, remaining stable for at least 20 minutes at temperatures between 180 and 200 degrees Celsius. Therefore, its performance is quite good. Below is an introduction to the use of epoxy glue.

  
  

  Epoxy Glue Precautions:

  When using epoxy glue, it's important to understand its instructions. First, its basic properties: the glue comes in two parts, so it needs to be mixed before use. This allows for filling even large gaps. Second, its operating environment. Generally, the glue cures at normal room temperature. Mixing the two parts can be done by hand or with specialized equipment, such as a glue gun.

  
  

  When using epoxy resin glue, pay attention to the ambient temperature; optimal temperatures are between -50°C and 150°C. Epoxy resin glue can be used in normal environments. It is waterproof and resistant to some aggressive substances, such as strong acids and alkalis. However, there are some important precautions when storing epoxy resin glue. It cannot be exposed to direct sunlight, so a cool, dark place is best. Generally, this type of glue has a shelf life of 12 months or less.

  
  

  When using epoxy resin glue, there are certain procedures to follow and some precautions to be aware of. First, clean the surface to be bonded. After an initial wipe, use a detergent for a second wipe to ensure thorough cleaning.

  
  

  Then, open the glue container and mix glues A and B in a 2:1 ratio. The glue cures quickly, so it must be used as soon as it is ready to bond. The best bonding results are achieved 24 hours after the adhesive is applied. After applying the glue, it needs a curing period. At room temperature, it should cure for 2 to 6 hours. At temperatures of 40 to 50°C, it should cure for 1 to 3 hours. The best bonding results are achieved ten days after the application.

  
  

  Epoxy Glue Application Instructions:

  1. Combine 1 part Agent A and 1 part Agent B and stir thoroughly.

  2. Apply the mixed adhesive to the bonding surface.

  3. Do not move or displace the bonded items for at least 40 minutes. For bisphenol A epoxy resin, this will severely affect the bonding effect.

  4. For aliphatic polyurethane acrylate adhesives, wait at least 20 minutes before using them. For polyester acrylate adhesives, this will affect the curing effect and bond life.

  
  

  Epoxy resin adhesives are classified in the following ways within the industry:

  1. Based on their primary composition, they are divided into pure epoxy resin adhesives and modified epoxy resin adhesives;

  2. Based on their specialized applications, they are divided into epoxy resin adhesives for machinery, epoxy resin adhesives for construction, epoxy resin adhesives for electronic eyes, epoxy resin adhesives for repair, as well as adhesives for transportation and marine applications;

  3. Based on their application conditions, they are divided into room temperature curing adhesives, low temperature curing adhesives, and other curing adhesives;

  4. Based on their packaging form, they can be divided into single-component adhesives, two-component adhesives, and multi-component adhesives.

  
  

  Other classifications exist, such as solvent-free adhesives, solvent-based adhesives, and water-based adhesives. However, classification based on the components is the most common application.

  Epoxy Resin Glue Characteristics:

  1. Basic Properties: Two-component adhesive requiring an A/B mixture. Versatile and capable of filling large gaps.

  2. Operating Environment: Cures at room temperature, suitable for both indoor and outdoor use. Can be mixed manually or with dedicated A/B glue equipment (such as an A/B glue gun).

  3. Operating temperature range: -50°C to +150°C.

  4. Suitable for general environments. Resistant to water, oil, strong acids, and alkalis. Store in a cool, dark place away from direct sunlight. Shelf life: 12 months.

• 26

  Aug, 2025

  Why do PCB circuit boards need to use conformal coating?

  What is conformal coating?

  
  

  Conformal coating (commonly known as circuit board mildew-proof paint, conformal glue, sealant, UV glue, thermal conductive glue, insulating varnish, circuit board protective paint, PCB protective paint, LED conformal paint, inverter paint, circuit board protective paint, PCB insulating paint, inverter conformal paint, solar circuit board conformal paint, communication circuit board conformal paint, waterproof insulating paint, conformal oil, and waterproof)

  
  

  Moisture is the most common and destructive factor for PCBs. Excessive moisture significantly reduces the insulation resistance between conductors, accelerates high-speed degradation, lowers Q values, and corrodes conductors. The patina we often see on metal parts of PCBs is caused by the chemical reaction between copper, water vapor, and oxygen, without conformal coating.

  
  

  The hundreds of contaminants found on printed circuit boards are equally destructive. They can cause the same consequences as moisture corrosion—electronic degradation, conductor corrosion, and even irreversible short circuits. The most common contaminants found in electrical systems are chemicals left over from the manufacturing process. Examples of these contaminants include flux, solvent release agents, metal particles, and marking inks. Other major contaminants are caused by human handling, such as body oils, fingerprints, makeup, and food residue. The operating environment also contains numerous contaminants, including salt spray, sand, fuel, acid, and other corrosive vapors, as well as mold.

  
  

  Applying conformal coating to printed circuit boards and components can reduce or eliminate degradation in electronic performance when exposed to adverse operating conditions. If this coating maintains its effectiveness for a satisfactory period, such as exceeding the product's service life, it can be considered to have achieved its intended purpose.

  
  

  Even a thin coating can, to a certain extent, withstand mechanical vibration and oscillation, thermal shock, and high-temperature operation. Of course, the notion that thin films can provide mechanical strength or adequate insulation for individual components inserted into a printed circuit board is misleading. Components must be mechanically secured and require their own appropriate gap filler to provide a double layer of protection against accidents.

• 26

  Aug, 2025

  COB packaging glue

  Fine-pitch LEDs have been booming over the past two years, with production increasing by nearly half year-on-year. Fine-pitch has rapidly evolved from full-color screens with Z3 and Z4 pitches. Before users had time to adapt, they were captivated by their performance, viewing angles, and seamless, large-screen color. However, the pixel count for fine-pitch has increased dramatically. A defective pixel rate of one in ten thousand, which seemed negligible with the Z4, has become noticeable with the Z2.5.

  
  

  A company installed a Z1.9 full-color screen. The user was particularly concerned about the defective pixel rate, requiring almost weekly maintenance, which has somewhat eroded the reputation of fine-pitch LEDs. Is fine-pitch LEDs truly plagued by defective pixel rates? One technology that has rapidly gained popularity in the past two years is the chip-on-board (COB) process. The COB process offers exceptional performance in stability, luminous efficacy, durability, and power consumption.

  
  

  Process Stability

  
  

  COB (Chip On Board) refers to packaging RGB chips on a circuit board. It is a new full-color LED process developed based on planar die bonding technology and precise dispensing techniques. During the COB production process, the IC is first mounted on a PCB, and then the chip is fixed to the substrate. Wire bonding is then used to establish an electrical connection between the chip and substrate. After passing inspection, the chip is sealed with glue, creating a full-color LED module.

  
  

  Traditional surface-mount LED displays require complex processing. During the reflow soldering process, the different expansion coefficients of the SMD lamp holder and the epoxy resin at high temperatures can easily cause the holder and epoxy resin to separate, creating gaps. This can lead to LED die during subsequent use, resulting in a high defect rate.

  
  

  COB technology displays are more stable because they don't require reflow soldering to mount the LEDs. This eliminates the problem of gaps between the lamp holder and epoxy resin caused by high-temperature soldering in the soldering machine. Therefore, COB products are less likely to die after leaving the factory. Furthermore, COB's unique packaging method effectively protects the LEDs, enhancing their resistance to damage.

  
  

  Durability

  
  

  COB-based fine-pitch LED displays are impact-resistant, waterproof, moisture-proof, dust-proof, oil-proof, anti-oxidation, and anti-static, making them wear-resistant and easy to clean. The raised spherical surface of the LEDs is smooth and hard, making them impact-resistant and wear-resistant. Bad pixels can be repaired individually. Dust can be cleaned with water or a cloth without a mask.

  
  

  Energy Efficiency

  
  

  COB displays use large-chip LEDs, which effectively increase brightness and dissipate heat evenly, with a low brightness decay coefficient, ensuring consistent brightness even after long-term use. Technicians compared the energy consumption of COB-P2.5 and SMD-P2.5 displays using a 480*480mm cabinet at 1000 nits. The COB consumes 80.57W, while the SMD consumes 165.7W. This indicates that, for equivalent brightness, COB displays dissipate less heat and are more energy-efficient.

  
  

  The significant advantages of COB packaging technology in terms of stability, luminous effect, durability, power consumption, etc. have established COB packaging as the mainstream packaging technology and market position.

• 26

  Aug, 2025

  Basic properties of thermal grease/thermal paste

  Basic Properties of Thermal Grease/Paste:

  1. Insulation and High Thermal Conductivity

  2. Low Settling, Low Oil Leakage, and Excellent Thixotropy

  3. Excellent High and Low Temperature Resistance and Excellent Weather Resistance

  4. Radiation Resistance and Excellent Dielectric Properties

  5. Excellent Chemical and Mechanical Stability

  6. Room Temperature Storage

  
  

  The liquid portion of thermal grease is composed of silicone and silicone oil. Most products on the market use dimethyl silicone oil as the raw material. Dimethyl silicone oil has a boiling point between 140°C and 180°C, which can easily evaporate and cause oil seepage, leaving grease marks on the circuit board. This grease detachment can cause customers to perceive the grease as dry. Jiadi New Materials' raw materials do not contain solvents or low-molecular-weight silicone oils. Therefore, Jiadi New Materials' products will not dry out or evaporate upon heating.

  
  

  Thermal grease can easily become unstable over time: Thermal grease is applied between the chip and the heat sink, remaining liquid and preventing solidification to effectively fill any gaps between the interfaces. Thermal grease is difficult to apply without bubbles. Many electronic components, such as PC, undergo temperature cycles during operation (from low to high and then back again). Thermal expansion and contraction can cause bubbles in the grease to change in volume, forcing the grease out of gaps. This phenomenon can occur after thermal cycling.

  
  

  Jiadi New Materials' solution is to control the low-molecular-weight siloxanes in the grease to prevent volatility and oil leakage at high temperatures. Furthermore, strict control of the viscosity range ensures excellent workability and prevents grease extrusion. After 20,000 power cycle tests, the thermal conductivity of the LS series remained essentially stable. Users can use Jiadi New Materials products with confidence.

  
  

  Jiadi New Materials' thermal greases offer excellent thixotropy and low settling properties, making them easy to store and apply.

• 26

  Aug, 2025

  Precautions for coating with conformal coating

  There are many types and grades of conformal coatings available on the market, and naturally, the application processes are also expanding. However, regardless of how the processes evolve, their operational procedures share many commonalities. What are these commonalities?

  
  

  1. The conformal coating application temperature should be between 30-50°C, and the relative humidity should not exceed 85%. Circuit boards, as composite materials, are susceptible to moisture. To ensure the full protective effect of the conformal coating and prevent dulling or whitish appearance due to moisture absorption, the circuit boards can be preheated and baked, and vacuum-dried to remove most of the moisture.

  
  

  2. Conformal coatings generally contain flammable solvents and should be avoided from high temperatures and open flames. Conformal coatings generally have a slightly pungent odor, so the operating room should be adequately ventilated to facilitate solvent evaporation and rapid curing. Prolonged inhalation of vapors and prolonged skin contact should be avoided. While the cured coating is generally harmless to the human body, safety precautions should be taken during the coating process. The environment should be well ventilated, and workers should wear protective masks.

  
  

  3. If you desire a thicker coating, it's best to apply two thinner coats, allowing the second coat to dry completely after the first.

  
  

  4. When applying conformal coating to circuit boards, connectors, sockets, switches, sensitive components, and plug-in areas are generally not permitted to be coated with coating material. Masking techniques must be used.

  
  

  5. Used brushes, spray guns, and other tools should be cleaned promptly with Osborne 108 thinner to prepare for the next use.

  
  

  6. Do not return poured conformal coating to its original packaging to avoid contaminating unused conformal coating. Unused conformal coating should be sealed and stored in a cool, dark place until ready for use.

  
  

  7. To repair a component already coated with conformal coating, simply contact the coating with a soldering iron to remove the component. Then, install the new component and clean the area with a brush or conformal coating thinner. Once dry, reapply conformal coating.

• 26

  Aug, 2025

  Methods for analyzing LED sulfuration failure

  LED sulfurization refers to the process by which silver ions in the LED coating react with sulfur ions to form black silver sulfide after the LED bulb comes into contact with sulfur-containing substances in the environment. High temperatures and high humidity accelerate this reaction.

  
  

  Impacts of LED sulfurization:

  1. The functional area of the bulb turns black, resulting in a decrease in luminous flux and a shift in color temperature.

  2. After the silver layer in the functional area transforms into silver sulfide, the contact force between the gold ball and the functional area decreases, making the bulb more susceptible to failure.

  
  

  Methods for analyzing LED sulfurization failures:

  1. While sulfurization is easy to observe, every subtle step in the production and application of LED bulbs can contribute to sulfur contamination. Sulfur sources are diverse, making the identification process complex and requiring the elimination of each contributing factor.

  2. Scanning electron microscopy-energy dispersive spectrometer (SEM-EDS) provides accurate elemental analysis of materials, effectively eliminating irrelevant factors and identifying the source of sulfur contamination.

  
  

  Case Study:

  
  

  

  
  

  A lighting manufacturer received a batch of sulfurized LED bulbs and commissioned Jinjian to investigate the cause of their failure. To identify the source of sulfur, Jinjian uses SEM-EDS equipment to trace all possible links that may lead to sulfurization. Packaging plants: Materials such as brackets, phosphors, and encapsulant, packaging, and transportation. Application plants: Materials such as circuit boards, solder, wires, coating glue, potting compound, rubber pads, adhesives, packaging, and transportation. Other: Auxiliary supplies (rubber gloves, cleaning agents), workshop environment, etc. End-user usage conditions and environment.

  
  

  

  

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