Component Solutions

Jiadi New Materials provides chip-level precision encapsulation and bonding solutions for the semiconductor industry, focusing on the extreme challenges of high voltage, low stress, and high temperature. Our high-end electronic adhesive products cover chip encapsulation, heat dissipation management, low-temperature bonding, and PCB protection, offering superior chemical stability and process compatibility. They ensure the long-term reliability of devices under harsh conditions, becoming the guardian of precision manufacturing and energy efficiency in the semiconductor industry.

Component Module Adhesive Points