New Energy Thermal Conductive Potting Adhesive

Thermal conductive potting adhesive is a fluid silicone thermal conductive composite material made from silicone resin as the base, filled with thermal conductive fillers, and processed through specialized techniques. It offers excellent thermal conductivity, electrical insulation, weather resistance, temperature resistance, moisture resistance, and anti-aging properties.

Low viscosity, good fluidity.

High physical and mechanical properties.

Resistant to cold and hot shock, high temperature aging.

High thermal conductivity, excellent heat dissipation effect.

Can maintain stable physical and mechanical properties for a long time at -50℃~200°℃.

JIADI New Energy Thermal Conductive Potting Adhesive is designed for electronic and new energy applications where thermal management and component protection must work together. After curing, the material forms a stable protective layer around electronic components, helping improve heat transfer, insulation performance, moisture resistance, and long-term operational reliability.

• Thermal conductive encapsulation: helps transfer heat away from electronic components, PCB assemblies, power modules, controllers, and other heat-generating parts, supporting stable operation in new energy equipment.

• Electrical insulation protection: forms an insulating potting layer after curing, helping reduce the risk of electrical leakage, short circuits, and unstable performance in compact electronic assemblies.

• Moisture and dust resistance: helps protect internal components from humidity, dust, condensation, and environmental contamination, making it suitable for electronic modules used in demanding operating conditions.

• Weather and aging resistance: designed for applications that may experience temperature changes, long operating hours, outdoor exposure, or environmental stress, helping improve the long-term durability of new energy electronic modules.

• Good flowability for potting: the material can flow into gaps around electronic components before curing, making it suitable for PCB boards, module cavities, power supply housings, and complex internal structures.

• Component fixation and vibration protection: helps stabilize electronic parts inside the housing and reduce the impact of vibration, shock, handling, and transportation on sensitive components.

• Thermal shock resistance: supports applications where electronic components may experience repeated heating and cooling cycles, helping reduce stress caused by temperature fluctuation.

• Silicone-based reliability: combines the flexibility, insulation, and environmental resistance of silicone materials with thermal conductive filler technology, making it suitable for new energy electronic protection.

• Suitable for multiple production processes: can be evaluated for manual dispensing, semi-automatic dispensing, or automated potting processes according to the selected model, production equipment, and application structure.

• Balanced protection performance: provides thermal conductivity, electrical insulation, moisture resistance, and mechanical protection in one potting solution, helping simplify material selection for new energy electronic modules.

When selecting a thermal conductive potting adhesive for new energy applications, buyers should consider the module structure, heat source layout, potting depth, viscosity requirement, curing condition, insulation requirement, adhesion to the housing, and expected operating environment. JIADI can provide material selection support according to the customer's actual product design and production process.