JIADI at electronica China 2026 | Exhibition Recap

JIADI Successfully Concludes Its Showcase at electronica China 2026

From July 1 to 3, 2026, JIADI New Materials participated in electronica China 2026 at the Shanghai New International Expo Centre. During the three-day exhibition, JIADI presented a range of adhesive, potting, sealing, and thermal management materials developed for power electronics, new energy systems, and demanding industrial electronic applications.

As one of Asia’s major exhibitions for electronic components, systems, applications, and solutions, electronica China brought together companies and industry professionals from across the electronics supply chain. The event provided JIADI with an important opportunity to present its material capabilities, understand evolving application requirements, and communicate directly with customers and industry partners.

Advanced Materials for High-Reliability Electronic Systems

At the exhibition, JIADI showcased several key material solutions designed to support the performance and reliability of modern electronic equipment:

• High-thermal-conductivity silicone potting compounds

• Electronic potting and encapsulation materials

• Thermal interface materials

• High-temperature-resistant structural adhesives

• Sealing and protection materials for power modules and electronic assemblies

These products are widely used in energy storage inverters, photovoltaic inverters, onboard chargers, high-density power supplies, industrial control systems, and other power electronic equipment.

As electronic devices move toward higher power density and more compact structures, effective thermal management has become increasingly important. Heat generated by power components must be transferred efficiently to help reduce the risk of localized overheating and support stable equipment operation.

At the same time, electronic assemblies often need to withstand moisture, vibration, temperature changes, electrical stress, and long-term environmental exposure. Suitable potting, sealing, bonding, and thermal management materials can therefore play an important role in protecting sensitive components and improving overall system reliability.

Customer Discussions Focused on Practical Application Challenges

Beyond product presentation, the exhibition enabled the JIADI team to hold in-depth technical discussions with customers and industry professionals. These conversations covered several common challenges in the design and production of electronic systems, including:

• Heat dissipation in compact, high-power assemblies

• Electrical insulation and component protection

• Waterproofing and environmental sealing

• Structural bonding under elevated temperatures

• Resistance to thermal cycling and material aging

• Long-term reliability under demanding operating conditions

Different electronic applications require different combinations of thermal conductivity, viscosity, curing speed, hardness, adhesion, dielectric performance, and environmental resistance. Selecting a suitable material therefore requires a clear understanding of the component structure, substrate, processing conditions, operating temperature, and expected service environment.

During the exhibition, JIADI discussed these requirements with visitors from the perspective of actual application conditions. This solution-oriented communication helped both sides explore how material selection and application processes could be better matched to specific electronic systems.

Supporting the Development of Power Electronics and New Energy Equipment

The rapid development of photovoltaic systems, energy storage equipment, electric vehicles, industrial automation, and high-density power supplies is creating higher performance requirements for functional materials.

Thermal management materials must not only transfer heat effectively but also remain stable throughout repeated temperature changes. Potting and encapsulation materials must provide protection while meeting processing and insulation requirements. Structural adhesives and sealing materials must maintain reliable bonding and protection under complex mechanical and environmental conditions.

JIADI continues to develop materials for these evolving requirements, with a focus on product stability, application adaptability, and long-term reliability. In addition to supplying individual materials, the company works with customers to evaluate application conditions and identify suitable product and process solutions.

Continuing Innovation and Customer-Oriented Technical Support

The successful conclusion of electronica China 2026 marked another valuable opportunity for JIADI to strengthen communication with the electronics and new energy industries. Feedback and technical discussions collected during the exhibition will support the company’s ongoing product development and application research.

JIADI will continue to focus on advanced functional materials for electronic applications while providing customers with stable products, customized solutions, and professional technical support. The company remains committed to helping customers address thermal management, insulation, sealing, bonding, and environmental protection challenges in increasingly demanding electronic systems.

JIADI sincerely thanks all customers, partners, and visitors who met with the team during electronica China 2026. We appreciate your interest and support and look forward to further communication and cooperation at future industry events.