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Currently, it is an important adhesive solution provider for many industries such as photovoltaic new energy, electronic appliances, automobile manufacturing power equipment, communication equipment, and optical fields.
JIADI at electronica China 2026 | Exhibition Recap
JIADI concluded its showcase at electronica China 2026, presenting thermal management, potting, sealing and adhesive solutions for power electronics.
Potting Compound vs Conformal Coating: Which Protection Method Fits Your Electronics?
Compare potting compound and conformal coating by environmental protection, heat transfer, component stress, weight, rework, and production process.
Energy Storage Adhesive Selection: Bonding, Potting, Sealing, and Thermal Management
Compare energy storage adhesives, potting compounds, sealants, and thermal materials for battery modules, BMS, enclosures, and power electronics.
Thermal Pad for Battery Packs: Engineering Selection
Learn how thickness, compression, tolerance, insulation, heat paths, assembly load, and validation shape thermal pad selection for battery packs.
26
Aug, 2026
High Dielectric Strength Potting Compound Verification
Understand how to evaluate high dielectric strength potting compound through test methods, thickness, void control, aging, geometry, and grade-specific evidence.
24
Aug, 2026
Thermal Adhesive vs Thermal Grease for Electronics
Compare thermal adhesive and thermal grease by bonding function, interface control, assembly pressure, reliability, and rework for electronic hardware.
20
Aug, 2026
RTV Silicone Potting Compound for Electronics Guide
Learn when RTV silicone potting compound may suit electronics assembly, and how cure access, depth, adhesion, rework, and validation shape selection.
18
Aug, 2026
Electronic Encapsulation Materials for Power Electronics: A Selection Framework
Compare silicone, epoxy, polyurethane, potting, and conformal coating roles to select electronic encapsulation materials for power electronics assemblies.
13
Aug, 2026
Dispensable Thermal Gel for Automated Electronics Production
Evaluate dispensable thermal gel by equipment compatibility, bead control, gap filling, compression, rework, and production consistency for electronics assembly.
10
Aug, 2026
