Epoxy Adhesive Series
Product Introduction
The two-component epoxy potting gel is formulated with special epoxy resins, modified hardeners, and specialized fillers. It features low viscosity and high permeability, and exhibits high hardness, low curing stress, aging resistance, and impact resistance after curing. It is suitable for potting and protecting electronic components, circuit boards, and other products.
Product Features
High hardness of the cured material, smooth and glossy surface.
Excellent water and oil resistance, dustproof.
Good resistance to cracking, puncturing, and abrasion.
Corrosion resistance, aging resistance, and resistance to thermal shock.
UL94V-0 flame retardant rating.
Typical Applications
Used in inverters, filters, transformers, LED waterproof power supplies, AC capacitors, sensors, and similar products.
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Epoxy Bonding and Fixing Adhesive
Epoxy Adhesive Series
